Core Applications
- Cutting metal traces and removing passivation
- Laser marking and semiconductor failure analysis
- LCD repair workflows and precision sample modification
VERSA Integration
- 26 in x 26 in VERSA working envelope with 200 mm – 300 mm chuck options
- Microscope gantry / optics support for upright microscope and laser-head mounting
- Two independent glide-and-lock platens for magnetic or vacuum-based positioners
- Dual-monitor sample viewing and control workflow with keyboard/mouse tray
- Supports wafer, die, board, packaged-part, DC, RF, high-power and mmW probing configurations
LS635B Laser System Highlights
- Air-cooled, diode-pumped MiniJewel laser with up to 50 Hz sustained repetition rate
- Selectable wavelength configurations: IR/GRN, GRN/UV3, and GRN/UV4
- Rotating aperture, internal LED spot illuminator, USB interface and optional Smart Controller
Laser Performance
| Wavelength | Energy / pulse | Pulse width | Full aperture stability |
|---|---|---|---|
| 1064 nm | >=1.25 mJ | 12 ns | <=3.0% |
| 532 nm | >=1.25 mJ | 11 ns | <=3.5% |
| 355 nm | >=0.4 mJ | 10 ns | <=4.0% |
| 266 nm | >=0.4 mJ | 10 ns | <=4.0% |
System Details
Laser head | 81 x 194 x 298 mm | 5.5 kg |
Power supply | 150 x 250 x 300 mm | <=4.5 kg |
Operating voltage | 100-240 VAC, 50/60 Hz |
Operating power | <100 watts |
Computer interface | USB |
Wafer Probing
Probe wafers up to 300mm with precise positioning and temperature control.
Package & Die Testing
Test packaged parts and individual die with ease and precision.
Board Level Testing
Probe complete boards and system level devices with flexible fixturing options.
Temperature solutions
Thermal chucks and chambers for hot & cold, vacuum, and light-tight testing.
RF, High Power & mmW
Supports advanced testing including RF, DC, mmWave, and high-power applications.